SIPLACE CA2

other manufacturing unknown ai-visionautonomousmodular

Multifunctional SMT placement machine and die bonder that processes SMDs and dies directly from sawn wafers in a single operation, designed for Advanced Packaging applications like SiP, Wafer Level Packaging, and Panel Level Packaging.

Headline specs

Price subscribers

Components 3

3 components on record — log in with a subscriber account to see the bill of materials and suppliers.